solutions

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Thermal Management

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Parallel Testing

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Bare Die

– Wide Range -65ºC to +160ºC

– Tri-temp

– Rapid Thermal Response

– High Power Cooling

– MEMS Calibration

Fastest thermal response for
bare die testing.

– Unlimited Parallelism

– Fast Index Times

– Seamless Burn-in & Test

– MEMS Test

“Increased throughput 3 times and
reduced manpower by a factor of 3”
SMI MEMS Test

– Cost Effective KGD

– Test Before/after Sacking

– Test-in-Tray

– Contactors

Advantest uses Centipede
Micro-torq wafer probe for full
wafer testing.

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