solutions

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Thermal Management

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Parallel Testing

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Bare Die

- Wide Range -65ºC to +160ºC

- Tri-temp

- Rapid Thermal Response

- High Power Cooling

- MEMS Calibration

Fastest thermal response for
bare die testing.

- Unlimited Parallelism

- Fast Index Times

- Seamless Burn-in & Test

- MEMS Test

“Increased throughput 3 times and
reduced manpower by a factor of 3”
SMI MEMS Test

- Cost Effective KGD

- Test Before/after Sacking

- Test-in-Tray

- Contactors

Advantest uses Centipede
Micro-torq wafer probe for full
wafer testing.

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