| Centipede is an technology leader managed by seasoned veterans of successful silicon valley start-ups. The Company provides micro-connection technology for electronics operating at the highest levels of density and performance, specializing in advanced burn-in and test. A continuing stream of new products includes advanced sockets, micro-connectors, test-in-tray components, and automated systems for testing MEMS devices. |
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Topic |
Publication |
Title |
Synopsis |
| Reliability | MicroConnections Vol. 2, No. 6, p. 1 August. 2009 |
Could You Have Known Your Product Had a Fatal Flaw? | Advanced techniques are available for detecting latent defects before they can cause a catastrophic system failure. |
| TnT | MicroConnections Vol. 2, No 5, p. 13 July 2009 |
Lights Out! | Heeding the call for greater efficiency in semiconductor test, a standard tray format enables full automation and a steeper learning curve for back end operations. |
| TnT | MicroConnections Vol.3, No. 4, p. 2 April 2009 |
Towards a More Efficient Test Paradigm | TnT offers unlimited parallelism in burn-in and test operations. The key enablers are a standardized tray and a reliable contactor. |
| TnT | MicroConnections Vol. 2, No. 4, p. 2 June 2009 |
Wanted: A Backend Transport Standard for Burn-in and Test | A standard tray format enables full “lights out” automation through back-end burn-in and test operations. |
| TnT | MicroConnections Vol. 2, No. 2, p. 1 March 2009 |
Test ‘n Tray: It’s Dynamite! | Easily automated test in tray format overcomes limitations of strip test while providing greatly increased throughput. |
| WLP | Chip Scale Review November 2008 |
Wafer Level Packaging – Today’s Realities and Future Potential | WLP has been successful in certian domains, but challenges lie ahead for mainstream applications of WLP. |
| WLP | Keynote Address IWLPC 2008 |
Wafer Level Packaging … The Promise Evolves | Wafer level packaging of high value devices is gated by a few simple but very important technological problems. |