Centipede is an technology leader managed by seasoned veterans of successful silicon valley start-ups. The Company provides micro-connection technology for electronics operating at the highest levels of density and performance, specializing in advanced burn-in and test. A continuing stream of new products includes advanced sockets, micro-connectors, test-in-tray components, and automated systems for testing MEMS devices.






Reliability MicroConnections
Vol. 2, No. 6, p. 1
August. 2009
Could You Have Known Your Product Had a Fatal Flaw? Advanced techniques are available for detecting latent defects before they can cause a catastrophic system failure.
TnT MicroConnections
Vol. 2, No 5, p. 13
July 2009
Lights Out! Heeding the call for greater efficiency in semiconductor test, a standard tray format enables full automation and a steeper learning curve for back end operations.
TnT MicroConnections
Vol.3, No. 4, p. 2
April 2009
Towards a More Efficient Test Paradigm TnT offers unlimited parallelism in burn-in and test operations. The key enablers are a standardized tray and a reliable contactor.
TnT MicroConnections
Vol. 2, No. 4, p. 2
June 2009
Wanted: A Backend Transport Standard for Burn-in and Test A standard tray format enables full “lights out” automation through back-end burn-in and test operations.
TnT MicroConnections
Vol. 2, No. 2, p. 1
March 2009
Test ‘n Tray: It’s Dynamite! Easily automated test in tray format overcomes limitations of strip test while providing greatly increased throughput.
WLP Chip Scale Review
November 2008
Wafer Level Packaging – Today’s Realities and Future Potential WLP has been successful in certian domains, but challenges lie ahead for mainstream applications of WLP.
WLP Keynote Address
IWLPC 2008
Wafer Level Packaging … The Promise Evolves Wafer level packaging of high value devices is gated by a few simple but very important technological problems.