Author Archives: Dr. Thomas Di Stefano

2011 SEMI Award for North America Given to Thomas DiStefano, John W. Smith, Jr. and Michael Warner for Chip Scale Packaging Technology

SEMI today named Thomas DiStefano, John W. Smith, Jr. and Michael Warner as recipients of the SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGAÒ ) technology.

Wanted: A backend transport standard for burn-in and test

Leaders in the semiconductor industry have learned well the lessons of the learning curve that underlies Moore’s Law, as they assiduously seek ways to accelerate their own learning curves. Fundamentally, the business is simple: Gain a few percentage points in the slope of your learning curve and you win.

Attending Semicon?

The Test In Tray User Group is a highlight of the test solutions session at 10:30 on July 16 in North Hall.

Towards a More Efficient Test Paradigm

There is a growing consensus that test and burnin (TBI) requires a new approach. SEMI’s CAST consortium is just the latest attempt to bring focus to an aspect of this looming problem.

Lights out!

Many anticipate that the next upturn in the semiconductor industry is around the corner. But when? And how? At some level we understand that each successive cycle entails new approaches and methods, winners and losers.

Could you have known your product had a fatal flaw?

Our lives in a complex world are increasingly dependent upon ubiquitous electronic devices, many of which are prone to unpredictable failure, leading in some cases to catastrophic losses.

We’ve Moved!

Centipede has a new facility in the heart of Silicon Valley: 41 Daggett Dr. San Jose, CA 95134